News Briefing

toktok newsletter will keep you up-to-date with the latest news on SK and member companies.

 

 

 

 

SK Chairman Chey Tae-won attended the new Memorial Wall of Remembrance dedication ceremony held at the Korean War Veterans Memorial in Washington D.C., USA in the morning of July 27th (local time) to honor the sacrifices of the troops fallen in the Korean War and console the bereaved families. Chairman Chey Tae-won was officially invited to join the Wall of Remembrance dedication ceremony hosted on the occasion of National Korean War Armistice Day. The Wall of Remembrance, dedicated at the Korean War Veterans Memorial is funded by the Korean government, Korean business organizations including SK Group and other private benefactors, features the names of U.S. service members and Korean augmentees to the U.S. Army who were killed during the war.
Chairman Chey Tae-won met with the bereaved family members of the war veterans during the ceremony to appreciate their dedication and sacrifice. In particular, he met with Mrs. Annelie Weber, widow of the late Korean War veteran Col. William Weber who had pushed for the construction of the Korean War Veterans Memorial, to bow down to her and hold her hands out of deference to and appreciation of his sacrifice. When asked by reporters what motivated him to donate 1 million dollars to the Wall of Remembrance project after the dedication ceremony, Chairman Chey Tae-won answered, “The Wall of Remembrance is one of the iconic signs of the ROK-US alliance,” and added, “I believed that it would remain etched in the memory of many if it is dedicated here at the heart of the United States.”

 

 

 

 

SK hynix has successfully developed the industry’s highest 238-layer NAND product. The company has recently shipped 238-layer 512Gb TLC (Triple Level Cell) 4D NAND flash samples to customers, planning to enter into mass production in the 1st half of next year. “We have succeeded in developing the next-generation NAND technology in just a year and seven months since the development of the 176-layer NAND product in December, 2020” said an official at SK hynix. “In particular, the latest 238-layer NAND product carries significance in that it is world’s most layered product featuring the smallest form factor at the same time.”
Consisting of more layers and featuring the world’s smallest size, the 238-layer product has boosted production efficiency by 34% in comparison with its predecessor, the 176-layer product. This gain in production efficiency is attributable to the fact that more chips featuring greater capacity per unit area can be harvested from each wafer. In addition, the data-transfer rate of the 238-layer product is 2.4Gb per second, 50% faster than the previous generation. Furthermore, the chip consumes 21% less energy when reading data, helping the company to meet its ESG commitment. SK hynix will first supply 238-layer products for cSSD (client SSD) used as PC storage devices, and further expand their applications to cover smartphones and server-compatible high-capacity SSDs.

 

*Depending on how many bits are stored in each memory cell, NAND flash divides into SLC (Single Level Cell, 1 bit), MLC (Multi Level Cell, 2 bits)-TLC (Triple Level Cell, 3 bits), QLC (Quadruple Level Cell, 4 bits), PLC (Penta Level Cell, 5 bits), etc. As more bits are accepted per cell, more data can be stored in the same area.